Posted by the employer · San Francisco, United States
Thermal Intern - Summer 2027
Astranis · San Francisco · United States
Posted: 9/24/2026 · On the employer's job feed since 10/11/2026
The advert
Quoted in full from Astranis's job posting. Gavroche does not edit it.
Astranis builds advanced satellites for high orbits, expanding humanity’s reach into the solar system. Today Astranis satellites provide dedicated, secure networks to highly-sophisticated customers across the globe – large enterprises, sovereign governments, and the US military.
With five satellites on orbit and many more set to launch soon, the company is servicing a backlog of more than $1 billion of commercial contracts. Astranis is the preferred satellite communications partner for buyers with stringent requirements for uptime, data security, network visibility, and customization.
Astranis has raised over $1.2 billion from some of the world’s best investors, including Andreessen Horowitz, Baillie Gifford, Blackrock, Fidelity, Franklin Templeton, and Snowpoint, and employs a team of 500 engineers and entrepreneurs. Astranis designs, builds, and operates its satellites out of its 153,000 sq. ft. headquarters in Northern California, USA.
Thermal Intern (Summer 2027)
As an Intern, you will have an amazing opportunity to work on hard problems — we pride ourselves on giving everyone at Astranis a chance to do meaningful work on complex projects, no matter their seniority. Many past interns have designed and tested hardware/software that is heading to space on our first satellite, and many of them are now full-time employees at Astranis.
Role
- Work together with the engineering team to design, evaluate, build, and test satellite hardware and/or software.
- Support design trades that successfully balance performance margins, resource use, risk, cost, and schedule.
- Perform thermal analysis to varying degrees of fidelity (simplified to detailed) on a variety of different types of hardware such as propulsion components, batteries, high powered electronics, RF components, mechanisms, and printed circuit boards (PCBs).
- Design, evaluate, procure and test thermal solutions such as heaters, heat pipes, thermal interface materials, and surface coatings.
- Develop processes and procedures for integration and assembly which ensure thermal design intent is met. Collaborate with the integration and test team in the installation of thermal hardware as needed.
- Plan and run thermal vacuum testing and verification at the component and spacecraft level.
Requirements
- Currently pursuing a B.S. or M.S. in mechanical, aerospace, or equivalent technical degree (e.g. physics or applied math)
- A passion and enthusiasm for hardware development, including working in a fast-paced environment and hands-on design and development
- Demonstrated ability to personally design, build, and test hardware from scratch.
- US Citizenship or Green Card
- Don't meet them all? Not a problem. Please apply even if you do not meet all these criteria.
Bonus
- Experience with CAD
- Experience with analytical software thermal analysis such as ANSYS and Thermal Desktop
- Experience with electronics systems design and packaging
- Experience (projects or previous internships) related to aerospace
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