Sr. IC Packaging Test Engineer - Silicon Technology - Starlink

Sr. IC PACKAGING TEST ENGINEER, SILICON TECHNOLOGY (STARLINK)

Starlink believes in providing fast, reliable internet to those that need it most. We design, build, and launch the world's largest and most advanced satellite constellation that is capable of delivering high-speed internet to even the most remote locations. We also design, build, and ship the hardware that sits in the homes of our customers all around the world. And while our hardware and network are incredibly advanced, we keep the end-user experience impressively simple - our customers have internet within 10 minutes of unboxing.

In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. We are looking for talented hands-on and dynamic test engineers with expertise in semiconductor packaging and wafer test. You will work closely with test equipment manufacturers and in-house chip & system designers to develop and release production test solutions. You will assume full ownership of packaged component and wafer test as we strive to make Starlink more affordable to those that need it most.

RESPONSIBILITIES:  

• Own electrical test equipment definition for packaging and wafer level production testing
• Bring-up of test equipment and test programs for mass manufacturing
• Create automated test equipment (ATE) test programs and test plans
• Define full and comprehensive testing requirements to ensure product conformance
• Schematic and electrical review for all test equipment
• Supplier test interface for implementing new features, cost, and productivity improvements
• Implement advanced testing solutions for SpaceX next generation products

BASIC QUALIFICATIONS: 

• Bachelor’s degree in electrical engineering, computer engineering, computer science, physics, or other applied engineering discipline  
• 5+ years of programming experience in C/C++/Visual/Python

PREFERRED SKILLS AND EXPERIENCE: 

• 10+ years industry experience with microelectronics packaging development
• Advanced technical degree
• Expertise in developing digital, high-speed and RF semiconductor test programs for production
• Strong RF test knowledge
• Experience with digital, high speed SERDES, RF, and mixed signal testing
• Wafer sort, wafer probe, probe card design and test experience
• Custom socket and wafer prober design and test experience
• Semiconductor functional and parametric test design and development
• Digital waveform and test plan programming development

ADDITIONAL REQUIREMENTS:

• Ability to work extended hours or weekends as needed for mission critical deadlines