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San Jose, United States

Senior Technical Program Manager - Silicon

Lumilens · San Jose · United States

Full timeProject Manager

Posted: 5/7/2026 · Last checked: 10/18/2026

Job description

Quoted in full from Lumilens's job posting. Gavroche does not edit it.

Senior Technical Program Manager

SAN JOSE, CA / Onsite

About Lumilens

Lumilens we are building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is unlocking a new era of computing faster, cooler, and massively more efficient.

We’re a well-funded startup backed by Mayfield and led by veterans who’ve built and scaled some of the most transformative technologies in the industry. This isn’t incremental innovation's a ground-floor opportunity to rethink the optical layer from the silicon up. You’ll work alongside a team of world-class engineers solving some of the hardest challenges in optics, systems, and scale. Every line of code, every design decision, every breakthrough you help deliver will shape the infrastructure of tomorrow.

If you're looking for mission, momentum, and the chance to make an outsized impact jump on the rocket ship. We’re just getting started.

About the Role:

Lumilens is seeking a Senior Technical Program Manager to own and drive complex silicon tapeouts, advanced packaging, bring-up, validation, and system-level integration programs. This is a high-visibility leadership role responsible for delivering high-quality silicon, packaged solutions, and validated systems on aggressive timelines in a fast-paced, innovative environment.

Key Responsibilities

  • Organize end-to-end planning, scheduling, and day-to-day execution for Lumilens’ silicon and package tapeouts, advanced packaging, bring-up, validation, and systems development programs.

  • Partner with engineering leads and cross-functional teams to accurately estimate, prioritize, and sequence work while balancing quality, scope, and schedule.

  • Create, maintain, and execute detailed project plans covering scope, schedule, budget, and resources, ensuring alignment with business objectives and key stakeholders.

  • Proactively manage schedules, risks, issues, and quality; escalate effectively and provide clear visibility to leadership.

  • Facilitate productive recurring meetings, technical reviews, and operational checkpoints throughout the project lifecycle.

  • Deliver concise, targeted communications to management and stakeholders on project status, key milestones, risks, and decisions.

  • Provide hands-on program management, cross-functional coordination, and internal/external stakeholder communications to achieve outstanding results.

  • Own release schedules, tapeout milestones, bring-up activities, and critical program deliverables in a dynamic, high-velocity setting.

  • Engage with vendors, customers, and external partners on program-related activities as required.

Qualifications

  • 10+ years of experience in Silicon design, tapeout, bring-up, validation, and product qualification.

  • Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical field.

  • Solid understanding of the silicon tapeout process (verification, signoff, mask ordering, etc.).

  • Experience with product bring-up, silicon validation, and qualification flows (EVT/DVT exposure is a plus).

  • Prior background in semiconductors (chip design, physical design, or test engineering preferred).

  • Ability to influence without authority and drive results in a matrixed, cross-functional environment.

  • Strong organizational skills with the ability to manage multiple priorities in a dynamic, fast-paced setting.

  • Proficiency with program management tools such as MS Project, Jira, Asana, Smartsheet, or equivalent.

  • Excellent written and verbal communication skills, including technical presentations.

Preferred Qualifications

  • Strong knowledge of photonic structures, optical communication, silicon photonics, laser solutions, and heterogeneous integration.

  • Experience with advanced packaging technologies (2.5D/3D integration, chiplets, silicon photonics packaging, etc.).

  • Experience building program management frameworks and processes from the ground up in a startup or new business unit.

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